Application Field
Mainly used in semiconductor, SMT, DIP, overlay IC, BGA, CSP, flip chip, LED and other inspections .
Function Features
Semiconductor Dedicated Off-Line Equipment
Equipped With Semiconductor Automatic Detection Algorithm
Geometric Magnification up to 70×
Resolution ≤2μm
Detector Tilt Angle 60° , The Stage Can Rotate 360°
Compatible with 2D, 2.5D, Extensible 3D
SPC Chart-CPK&GRR
Technical Parameters and Specifications
| System Summary | |
| Footprint | 1550*1770*1825mm |
| Machine Weight | 2900kg |
| Power Supply | 220AC/50Hz |
| Power | 3.5kW |
| X-Ray Tube | |
| Tube Type | Seale Type |
| Max. Voltage | 110kV |
| Tube current | 250μA |
Focal Size | 5μm |
| Imaging Detector | |
| Detector | High Resolution FPD |
| Effective Dectection Area | 116.4*145.7[mm] |
| Frame Rates | 10fps |
| Pixel | 2532*2944[pixel] |
| Pixel Size | 49.5μm |
| Motion Control System | |
| Motion Control Method | Mouse & Keyboard |
| Desktop | X/Y/Z/R |
| Flat Panel | One-way Maximum 50° |
Maximum Loading Size | Φ570[mm] |
| Maximum Inspection Size | 410*450[mm] |
| Magnification range | ~200X/~50X |
| Software | |
| Automatic picture setting | Record the location coordinates and parameter information of feature points |
| Location Editing Function | easily realize multi-point running detection |
| Automatic determination by algorithm | Equipped with semiconductor automatic detection algorithm |
| Other Featrues | |
| Door opening method | Manual door |
| X-Ray Safety | <1µSv/h (Meets All International Standards) |
| * Specifications are subject to change without notice, All trademarks are the property of the system maker. | |
Inspection images
Dimensions and Appearance
Unicomp | X-Ray Inspection
Home Products Applications News Services About Us Contact Us