Breaking News from UnicompGroundbreaking Ceremony of Unicomp New Headquarter Industrial Park held on 2nd Jan, 2025 in high tech district of WuxiAccompanied by Unicomp President Dr Jun Liu, top district government officials, management team of construction contractor, were presented at the ceremony.T

From Nov. 12th to 15th, the four-day Munich International Electronic Components Expo (ELECTRONICA 2024) grandly opened at the Munich International Exhibition Center.As a pioneer in Chinese industrial X-ray intelligent inspection, Unicomp Technology showcased cutting-edge technological innovations fr

Exhibition for EMS smart inspection technology：As a leading manufacturer of Xray inspection equipment, with the purpose to demonstrate to the world the capability of innovation in industrial smart Xray inspection, Unicomp exhibited it`s self developed and researched core technology during the show.

By Coco Fengin BeijingChina’s total integrated circuit (IC) output surged 40 per cent to 98.1 billion units in the first quarter, a sign that the country is expanding its production of older-generation chips while being constrained by US trade restrictions on advanced chip-making equipment.National

The European Semiconductor Industry Association (ESIA) reports on the latest semiconductor market forecast by the World Semiconductor Trade Statistics (WSTS). Exceeding the spring projections with slightly better Q2 and Q3 results, the updated market valuation for 2023 is now estimated at US$ 520 bi