Views: 0 Author: Site Editor Publish Time: 2026-10-30 Origin: Site
UNICOMP x NEPCON ASIA 2026
27–29 October
Shenzhen World Exhibition & Convention Center (Bao’an New Venue)
UNICOMP (Booth E55, Hall 13) presents its AI-powered industrial non-destructive intelligent inspection solutions at NEPCON ASIA 2026. Our intelligent inspection safeguards the full electronic manufacturing workflow from R&D through mass production.
Building Intelligent Quality Barriers: A Portfolio of Premium Inspection Systems on Display
UNICOMP underpins its technological foundation by integrating core components and multi-dimensional proprietary algorithms across its key systems,
including sub-micron X-ray, open-tube CT and in-line 3D inspection equipment.
AX9100 — Precision Electronics Intelligent X‑ray Inspection System
It delivers strong penetration, multi-angle imaging and precise positioning to address pain points for high-density electronics,
including defect control for cold solder joints, voids and misalignment, as well as solder fillet height measurement.
AX9600 — Open‑Tube Intelligent X‑ray Inspection System for Semiconductors
Equipped with UNICOMP’s self-developed 160kV open micro-focus X-ray source, it readily detects various defects in processes such as 3D packaging and IC wire bonding, and captures fine details of micro-features in TGV and TSV structures.
AX9500 — Sub‑Micron 3D/CT Inspection System
It delivers sub‑micron 3D tomographic imaging to accurately capture and identify critical defects including wafer bump bridging, chip cold welding and voids in MEMS fabrication.
LX9200 — High‑Speed In‑line 3D/CT Inspection System
It supports rapid switching among 2D / 2.5D / 3D inspection modes to perform in‑line defect inspection for complex electronic modules with high density, high integration and special‑shaped designs.
Full‑Portfolio Micro‑Focus X‑ray Sources
UNICOMP’s X‑ray sources form a full‑scale, penetrative quality insight system, delivering self‑reliable core technological support for high‑end intelligent inspection.
Joint R&D & In-depth Exchange: Collaborate to Tackle Smart Manufacturing Challenges
UNICOMP’s technical experts shared cutting‑edge insights covering open‑tube core technology, back‑drill inspection solutions, AI defect recognition algorithms and more. Senior UNICOMP engineers also hosted customer engagement activities including on‑site technical consultations and interviews to hear real‑world pain points, offering one‑stop relief for quality‑control challenges in electronic smart manufacturing.
Going forward, UNICOMP will continue to empower cutting‑edge industries such as AI computing, advanced packaging and humanoid robotics with platform‑based intelligent inspection services, and build a quality safeguard for high‑end electronic smart manufacturing together with industry customers.
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TO SEE THE FUTURE
