Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc.

Widely applied for Electronics components in Tape & Reel, JEDEC Tray and Tube package, PCBA, BGA, CSP, Flip Chip, LED, Fuse,
Diode, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components,
Photovoltaic Industry, etc.

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc.

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc.

 All X-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems. The FDA - CDRH standard for cabinet x-ray systems states that radiation emission will not exceed. 5millirem a /hr.2"from any external surface. Our machines (Leakage <1μSv/h) are typically 5-10 times less than the international standards