Views: 0 Author: Site Editor Publish Time: 2026-03-28 Origin: Site
On March 26, 2026, the 21st EM Innovation Awards Ceremony was held in Shanghai.
Featuring advanced capabilities including "0.8μm-level full defect capture, nanoscale imaging, and full-range AI intelligent inspection",
Unicomp Technology’s AX9600 won the EM Innovation Award.
Unicomp’s Open-Tube X-RAY
AX9600 Semiconductor Intelligent Inspection Equipment
Equipped with Unicomp’s self-developed 160kV open-type microfocus X-ray source, it readily meets the inspection requirements of AI computing chips such as HBM and GPU, as well as advanced packaging applications.
• 2000X Super Magnification • High-Definition Real-Time Imaging
•360° Omnidirectional Inspection • AI-Powered Automatic Defect Measurement
As a highly prestigious accolade in the electronics manufacturing industry,
the EM Innovation Award selects suppliers that have made outstanding contributions to the development and innovation of the sector,
based on seven dimensions including innovation capability, production capacity improvement and process advancement.
This recognition underscores that the robust performance of the AX9600 has earned high acclaim from both the industry and the market,
while also demonstrating the full trust and strong preference of industry customers for Unicomp Technology.
