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Exhibition: CID&CNF 2025 Shanghai (July 16–18, Booth N2C31) Unicomp Technology, a global leader in advanced X-ray inspection, is thrilled to announce its participation in the 19th Shanghai International Die Casting & Non-Ferrous Casting Exhibition (CID&CNF 2025). Taking place from July 16–18, 2025,
Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen, China Zip-code: 518107
