You are here: Home » Products » Semicon X-Ray » Semiconductor Microfocus X-ray Inspection Equipment AX8300S

Product Detail

loading

Semiconductor Microfocus X-ray Inspection Equipment AX8300S

Unicomp Technology X-ray Inspection Equipment——AX8300S 

As a new generation of upgraded and optimized AX8300S  In-line inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users.
Availability:
  • AX8300S

  • UNICOMP

Application Field


SMT/PCBA Package type:

 Semiconductor, Substrate, Lead Frame & Wire Bonding Inspection


Semiconductor Package type:W/B、IC、F/C...
Defect type:Void、Open、Short、Sweep、Solder ball...
Other areas Battery, IGBT...


Function Features


  1. Off line equipment for semiconductors

  2. Equipped with automatic semiconductor detection algorithms

  3. Geometric magnification up to 200 x

  4. Resolution ≤2μm  

  5. Detector Tilt Angle 60°

  6. Compatible with 2D, 2.5D, expandable 3D

SPC Chart-CPK&GRR


Technical Parameters and Specifications

System Summary
Footprint

1550*1650*1710mm

Machine Weight ≈2500kg
Power Supply

220AC/50Hz

Power

3kW

X-ray Leakage < 1µSv/h
Imaging System
Tube Type

 Seale

Max. Voltage 110kV
Detector FPD

Pixel Matrix

2350*2944

[pixel]

* Specifications are subject to change without notice, All trademarks are the property of the system maker.


Inspection images

新官网 03



footprint-LX9200

Previous: 
Next: 
Contact Us
PROFESSIONAL SOLUTIONS FOR YOU

Unicomp | X-Ray Inspection

Leave a Message
Contact Us

QUICK LINKS

PRODUCTS CATEGORY

CONTACT US

  +86-755-8527-1589 (Working time)
  info@global-xray.com
  Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen, China
Zip-code: 518107
Copyright  2021 Unicomp Technology Co., Ltd. All rights reserved                    www.unicomp.cn                  www.unicompxray.com