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X-ray Inline Automatic Inspection Machine LX9200

Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200

As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users.
Availability:
  • LX9200

  • UNICOMP

Application Field

SMT/PCBA Package type:BGA、LGA、CSP、POP、SIP...
Defect type:Void、HIP、Insufficient、Bridge...
Semiconductor Package type:W/B、IC、F/C...
Defect type:Void、Open、Short、Sweep、Solder ball...
Other areas Battery, IGBT...


Function Features

  • 2D, 2.5D, 3D all in one Inline X-Ray Inspection System

  • Multiple Resolution Selected (Max. 6μm)

  • 130KV Closed Micro-focus X-Ray Generator

  • Real-time image with HD FPD Detector

  • 11 axis Linkage System

  • 360° Circular CT Image

  • Data Tracking and Reworking System Embedded


Technical Parameters and Specifications

System Summary
Footprint 1640(W)*2070(D)*1800(H)mm
Machine Weight ≈3450kg
Power Supply 220AC/50Hz
Power 5.5 kW
X-ray Leakage < 0.5µSv/h
Imaging System
Tube Type Closed
Max. Voltage 130kV
Detector FPD
Image Acquisition 2D/2.5D/3D
Inspection Area
Max. Inspection Area (M Size) 255*330mm
Max. Inspection Area (L Size) 440*550mm
Max.Inspection Area (XL Size) 610*1200mm
PCBA thickness 0.5~5mm
PCBA Craft side 5mm
PCBA warpage compensation ±2mm
Clearance Top 70mm
Clearance Bottom 40mm
* Specifications are subject to change without notice, All trademarks are the property of the system maker.


Inspection images

2D-BGA 2D-BGA
AXI-PCBA AXI-PCBA
AXI-IGBT AXI-IGBT
CT-BGA CT-BGA
CT-IC CT-IC
CT-DIP CT-DIP

footprint-LX9200

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