Groundbreaking Ceremony (Left to Right): Mr. Marcin Fabianowicz, Mr. Brain Shih, Mr. Felix Timmermann, Mr. Ryszard Pacholik, Mr. Shupin WuOn 20th June, USI (SSE 601231), a leading electronic and SiP manufacturing company, marked a significant milestone with the groundbreaking ceremony for its second

Recently, one of customized NDT X-ray inspection system produced by Unicomp Technology for lightweight automobile one-piece EV rear frame aluminum casting parts was successfully passed the FAT pre-acceptance by end customer, will be installed and commissioned in a world famous Foundry for automotive