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AX7900
UNICOMP
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc.
Application Fields
Functions and Feature
Inspection Images
Dimensions and Appearance
System Summary | |
Footprint | 1200(W)×1285(D)×1700(H)mm |
Machine Weight | 1235 kg |
Power Supply | 220V±10%, 50/60Hz |
Power Consumption | 800W |
X-Ray Tube | |
Tube Type | Sealed |
Max. Power | 8W |
Voltage | 90kV |
Focus Spot Size | 5μm |
Imaging System | |
Detector | Flat Panel Detector (FPD) |
Pixel Size | 84μm |
Effective Detection Area | 129*129mm |
Frame Rates | 30fps |
Pixel Matrix | 1536*1536mm |
Geometric Magnification | 52X |
Software | |
Navigation And Positioning | Quickly Locate Physical Images |
Automatic Calculation | Automatic Bubble Measurement For BGA,QFN And Other Packaged Electronic Components, And Support The Output Result Report |
CNC Automatic Inspection | Support Single Point And Matrix Addition,Quickly Generate The Project,The Result Can Be Graphically |
Information Display | Support Real Time Process Information Of Inspection |
Diverse Measureing Tools | Support Distance,Angle,Diameter,Ploygan And Other Geometric Measurements |
Motion Control System | |
Movement Control | Joystick, Keyboard & Mouse |
Max. Loading Area | 600*520mm |
Max. Inspection Area | 505*440mm |
Tilting Angle | ±25° |
Industrial PC | |
Monitor | 24’’HD Display |
System OS | Windows 11 64bit |
Hard disk | 1TB |
RAM | 16GB |
CPU model | Intel i7 Processor |
Other Features | |
Energy Saving | X-Ray Auto-off when it's outof work over than 5 minutes |
X-Ray Safety | <1μSv/h (Meets All International Standards) |
Authority Management | Fingerprint Access Magnagement System, and Support Password Accessing. |
Safety Operation | Electromagnetic Interlock, Warning Light and Real-time Radioation Leakage Monitor |
* Specifications are subject to change without notice, All trademarks are the property of the system maker.
