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Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc.
AX9100vs
UNICOMP
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc.
Application Fields
Functions and Feature
Application Cases
System Summary | |
Footprint | 1400(W)×1720(D)×1800(H)mm |
Machine Weight | 2925 kg |
Voltage | Single-phase 220VAC, 50/60Hz |
Plywood Packing Size | 1650(W)×1800(D)×2000(H)cm |
Power Consumption | 4.5kW |
| Voltage | 130kv |
| Tube Type | Closed |
Stage | |
Loading Area | 530(X)*530(Y)mm |
Max. Inspection Area (2D/2.5D) | 500(X)mm*500(Y)mm |
Max. Inspection Area(3D) | Planner 3D:400(X)mm*400(Y)mm;Cone-bem 3D:50(D)mm*150(L)mm |
Sample Weight | 10kg |
Software | |
Auto Navigation Function | Base on 'Teach and Go' position array,available with batch mode inspection. |
Measurement Function | Void percentage,distance,area,etc. |
Other Features | |
Motion Control Method | Mouse+Dual Joystick+Keyboard |
Control Unit | Control PC |
3D Construction Method | Multi-mode 3D Reconstruction |
X-Ray Safety | <0.5μSv/h |
* Specifications are subject to change without notice, All trademarks are the property of the system maker.
Dimensions and Appearance
